A polishing fluid for polishing of components, preferably wafers, in particular for chemically - mechanical polishing of structural elements of this type

摘要

The invention relates to a polishing liquid for polishing components, preferably wafers, especially for chemically-mechanically polishing components of this type, and to a method for producing the polishing liquid. The inventive polishing liquid has a polishing base liquid and an oxidising agent. The aim of the invention is to provide an economical polishing agent which is also simple to produce, which can be used as an alkaline or acidic polishing agent and with which metallic layers in particular can be polished. To this end, ozone is used as an oxidising agent. Ozone is a strong oxidising agent whose redox potential is sufficient for oxidising or polishing the metals used in an acidic or alkaline environment.