POLISHING LIQUID FOR POLISHING COMPONENTS, PREFERABLY WAFERS, ESPECIALLY FOR CHEMICALLY-MECHANICALLY POLISHING COMPONENTS OF THIS TYPE

摘要

A polishing liquid for components, preferably wafers, a process for producing a polishing liquid and a process for chemical mechanical polishing of components are provided. The polishing liquid has a polishing base liquid and an oxidizing agent. The aim is to provide an economical polishing agent which is also simple to produce, which can be used as an alkaline or acidic polishing agent and with which metallic layers in particular can be polished. Ozone, which is used as an oxidizing agent, is a strong oxidizing agent having a redox potential that is sufficient for oxidizing or polishing the metals in an acidic or alkaline environment.