POLISHING LIQUID FOR POLISHING COMPONENTS PREFERABLY WAFERS ESPECIALLY FOR CHEMICALLY-MECHANICALLY POLISHING COMPONENTS OF THIS TYPE

摘要

TECHNICAL FIELD The present invention relates to a polishing solution for chemically-mechanically polishing a component, particularly a wafer, particularly a component of the above-mentioned type, and a method for producing the polishing solution. The polishing liquid according to the present invention comprises a polishing base liquid and an oxidizing agent. It is an object of the present invention to provide an economical abrasive which can be produced by a simple method, wherein the abrasive can be used as an alkaline or acidic abrasive, and the metal layer can be polished especially with the oxidizing agent. Ozone is also used as the oxidizing agent. The ozone is a strong oxidizing agent, and its redox potential is sufficient to oxidize or polish the used metal, even in an acidic or alkaline environment.