PROBLEM TO BE SOLVED: To more efficiently use functions regarding the exposure of a projection aligner. ;SOLUTION: When exposure is made through a first process for measuring a first accurate measurement for aligning a preceding substrate, and a second process for performing a simpler second measurement than the first measurement successively for the next substrate and for performing exposure by performing alignment based on the result and the result of the first measurement, the first process (S003) is made by a device (wafer offset-measuring device AL) that is separate from projection aligners (steppers ST1, ST2).;COPYRIGHT: (C)2001,JPO
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