首页> 外国专利> CONFIGURATION OF CHAMBER IN AUTOMATIC SINGLE WAFER WASHING APPARATUS

CONFIGURATION OF CHAMBER IN AUTOMATIC SINGLE WAFER WASHING APPARATUS

机译:自动单晶圆清洗设备中腔室的配置

摘要

PROBLEM TO BE SOLVED: To improve an automatic single wafer washing apparatus for cleanly and drying wafers, eliminating splashed contaminants encountered in conventional marline. ;SOLUTION: A space is widened between a chamber and a rotating member accomodating the wafers as it comes closer to air and water outlets. Air flow and liquid flow can be directed farther outside the rotating member due to adoption of a kind of eccentric chamber. Consequently, contaminants also go farther outside the rotating member, and the wafer can be washed and dried more cleanly all over the surface.;COPYRIGHT: (C)2001,JPO
机译:要解决的问题:改进用于清洁和干燥晶片的自动单晶片清洗设备,消除传统水银中遇到的飞溅污染物。 ;解决方案:当处理室和旋转部件更靠近空气和水出口时,容纳晶圆的旋转部件之间的空间变大。由于采用了一种偏心室,所以空气流和液体流可以被引导到旋转构件之外更远的位置。因此,污染物也更向旋转部件的外部移动,并且可以在整个表面上更干净地洗涤和干燥晶片。;版权所有:(C)2001,JPO

著录项

  • 公开/公告号JP2001135607A

    专利类型

  • 公开/公告日2001-05-18

    原文格式PDF

  • 申请/专利权人 HAMAYA SUMIO;

    申请/专利号JP19990359598

  • 发明设计人 HAMAYA SUMIO;

    申请日1999-11-04

  • 分类号H01L21/304;B08B5/00;

  • 国家 JP

  • 入库时间 2022-08-22 01:30:55

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号