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Wafer spray configurations for a single wafer processing apparatus
Wafer spray configurations for a single wafer processing apparatus
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机译:单个晶圆处理设备的晶圆喷涂配置
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摘要
The present invention is a single wafer process apparatus which includes a rotatable wafer support for rotating a wafer about its central axis. Additionally, the single wafer processing apparatus includes a plurality of liquid spray nozzles for creating a spray pattern of liquid onto a wafer located on the wafer support wherein the entire surface of the wafer is covered with the spray pattern.
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