首页>
外国专利>
PHOTO-SOLDERING RESIST RESIN COMPOSITION FOR ELECTROLESS GOLD PLATING AND RESIST PATTERN FORMING METHOD
PHOTO-SOLDERING RESIST RESIN COMPOSITION FOR ELECTROLESS GOLD PLATING AND RESIST PATTERN FORMING METHOD
展开▼
机译:无电镀金的光熔抗蚀剂树脂组成及抗蚀剂图案形成方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To obtain a photo-soldering resist resin composition excellent in resistance to electroless gold plating. ;SOLUTION: The photo-soldering resist resin composition for electroless gold plating contains (A) one or more nitrogen-containing compounds selected from the group comprising imidazole, pyrazole, thiazole, dithiazole, triazole, tetrazole and their derivatives, (B) an unsaturated resin containing a carboxy group and, optionally, a hydroxy group, (C) a photopolymerization initiator and (D) one or more curing agents selected from a curing agent having a functional group which reacts with the carboxy group in the resin B and a curing agent having a functional group which reacts with the hydroxy group optionally contained in the resin B.;COPYRIGHT: (C)2001,JPO
展开▼