PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING SHAPED OBJECT BY PLATING

摘要

The present invention is a photosensitive resin composition which comprises an alkali-soluble resin (A), one or more polymerizable compounds (B), a free-radical photopolymerization initiator (C), and a solvent (D), wherein the polymerizable compounds (B) include at least one compound (B1) selected from among compounds represented by formula (1) and compounds represented by formula (3), the formulae (1) and (3) each including specific R moieties, the content of the compound (B1) in the photosensitive resin composition being 15-50 mass%. The photosensitive resin composition of the present invention can form thick resist patterns excellent in terms of sensitivity and resolution. Use of the thick resist patterns makes it possible to produce finer shaped object by plating.