Photosensitive resin composition, method for forming resist pattern, method for producing plating molding, and semiconductor device

摘要

Excellent resolutionA photosensitive resin composition capable of forming a resist pattern capable of corresponding to copper plating and nickel platingMethod for forming resist pattern using photosensitive resin compositionManufacturing method of plating molding using resist patternFor the purpose of providing a semiconductor device having a plating structureThe composition isThe structural unit (A1) shown in the following formula (A1)The structural unit (A2) shown in the following expression (A2)A polymer (a) and a photoacid generator (b) having a structural unit (A3) shown in the following formula (A3) are included.In formula (A3), R33 indicates a hydroxyl aryl group.