首页>
外国专利>
APPARATUS AND METHOD FOR DRILLING MICROVIA HOLES IN ELECTRICAL CIRCUIT INTERCONNECTION PACKAGES
APPARATUS AND METHOD FOR DRILLING MICROVIA HOLES IN ELECTRICAL CIRCUIT INTERCONNECTION PACKAGES
展开▼
机译:在电路互连包中钻微孔的装置和方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
This invention applies the use of shaped beams of laser radiation for increasing the maximum speed of tools used to laser drill microvia holes in PCB's, PWB's and other electrical circuit packages (8). With an annular spatial intensity distribution, the maximum speed can be increased several fold from machines which do not incorporate such laser beam shaping. Different hole diameters on a one device can be programmed using a set of ring beam shaping elements incorporated into a single transmissive mask element whose lateral position when placed in the beam is computer-controlled.
展开▼