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Characterization and electrical circuit modeling of interconnections and packages using time domain network analysis

机译：使用时域网络分析对互连和封装进行表征和电路建模

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Graduation date: 1994

机译：毕业日期：1994

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年度 1993
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正文语种 {"code":"en","name":"English","id":9}
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1. Time-domain characterization and circuit modeling of a multilayerceramic package [J] . Jyh-Ming Jong, Janko B., Tripathi V.K. IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1996 ,第1期

机译：多层陶瓷封装的时域表征和电路建模
2. Time-domain characterization and circuit modeling of a multilayerceramic package [J] . Jyh-Ming Jong, Janko B., Tripathi V.K. IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1996 ,第1期

机译：多层陶瓷封装的时域表征和电路建模
3. Time-domain characterization and circuit modeling of a multilayer ceramic package [J] . Jyh-Ming Jong, Janko B. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging . 1996 ,第1期

机译：多层陶瓷封装的时域表征和电路建模
4. Electrical characterization of POLYHIC, a high density, high frequency, interconnection and packaging medium for digital circuits [C] . Brandner, J.L., Faudskar, Electronic Components Conference, 1989. Proceedings., 39th . 1989

机译：POLYHIC的电气特性，一种用于数字电路的高密度，高频，互连和封装介质
5. Characterization and electrical circuit modeling of interconnections and packages using time domain network analysis. [D] . Hayden, Leonard A. 1993

机译：使用时域网络分析对互连和封装进行表征和电路建模。
6. Characterization of Folding Mechanisms of Trp-cage and WW-domain by Network Analysis of Simulations with a Hybrid-resolution Model [O] . Wei Han, Klaus Schulten -1

机译：基于混合分辨率模型的网络分析表征Trp笼和WW域的折叠机制
7. Incorporation of feed-network and circuit modeling into the time-domain finite element analysis of antenna arrays and microwave circuits [O] . Wang Rui 2010

机译：将馈电网络和电路建模结合到天线阵列和微波电路的时域有限元分析中

Characterization and electrical circuit modeling of interconnections and packages using time domain network analysis

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