首页> 外国专利> A PROCESS ON DIFFUSION BONDING BETWEEN FE-BASED AND CU-BASED MATERIALS IN SEMI-SOLID REGION

A PROCESS ON DIFFUSION BONDING BETWEEN FE-BASED AND CU-BASED MATERIALS IN SEMI-SOLID REGION

机译:半固态区域铁基和铜基材料之间的扩散键合过程

摘要

Purpose: a kind of diffusion bonding method for a kind of Fe alloys and an Albatra metal is arranged to simplify a process and reduces two alloys that a cost is diffusely incorporated in half solid-state areas. Construction: in order to diffusely combine a kind of Fe alloys and an Albatra metal, the surface of copper alloy reduces and Fe alloys is used to assemble. Here, the fusing point of copper alloy is lower than Fe alloys. The alloy of assembling is packed into a stove and controls under a vacuum, nitrogen, argon gas or complex gas atmosphere. Then, 1060deg. is arrived 750The semi-solid temperature of C, alloy is heated and is maintained at the semisolid of regularly time for diffusion bond. After that, the cooled air of bonding alloy or in a furnace.
机译:目的:一种用于Fe合金和Albatra金属的扩散键合方法可以简化工艺并减少两种合金的成本,因为两种合金的成本分散在半固态区域。构造:为了使一种铁合金和一种信天翁金属弥散地结合在一起,铜合金的表面减少了,铁合金被用来组装。在此,铜合金的熔点低于铁合金。将组装好的合金装入炉子并在真空,氮气,氩气或复杂气体气氛下进行控制。然后,1060度。到达750°C,合金的半固态温度被加热并定期保持在半固态以进行扩散结合。此后,将粘结合金的冷却空气或放入炉中。

著录项

  • 公开/公告号KR100272755B1

    专利类型

  • 公开/公告日2000-11-15

    原文格式PDF

  • 申请/专利权人 KIM WOO YEOL;KIM JONG DEOG;

    申请/专利号KR19980019355

  • 发明设计人 KIM WOO YEOL;

    申请日1998-05-20

  • 分类号B23K20/00;

  • 国家 KR

  • 入库时间 2022-08-22 01:14:25

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号