PURPOSE: An apparatus and a method for a wet etching are provided to shorten a processing time and also to effectively prevent defects of patterning during an etching operation. CONSTITUTION: The wet etching apparatus is characterized by an excimer ultraviolet cleaner(72) formed in a loading unit(70), and a conveyer(76) formed between the ultraviolet cleaner(72) and a waiting unit(74). Pluralities of substrates to be wet-etched are contained in a cassette(78). When the cassette(78) is loaded on the loading unit(70), the substrate is taken out from the cassette(78) and then placed on the conveyer(76) by the first robot(80). The conveyer(76) transfers the substrate to the ultraviolet cleaner(72) so as to remove foreign matters staying on the substrate, and then moves the substrate to the waiting unit(74). Next, the substrate is supplied to an etching unit(82) through the waiting unit(74), and then the wet etching operation is performed by using etchant solution. After the etching, the etchant solution flows down from the substrate in a tilt drain unit(84), and then residual etchant solution is completely removed by using deionized water in a rinse unit(86). Next, the second robot(90) moves the substrate to a spin dry unit(88), and then the substrate is dried in the spin dry unit(88).
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