首页> 外文会议>MRS Meeting >Wet etching methods for perovskite substrates
【24h】

Wet etching methods for perovskite substrates

机译:钙钛矿基材的湿法蚀刻方法

获取原文

摘要

In oxide electronics substrates with atomically flat terraces are a request for growing high-quality epitaxial thin films. In this paper results on chemical etching of some substrates with perovskite, ABO{sub}3, structure (e.g., SrTiO{sub}3, LSAT - the (LaAlO{sub}3)0.3(Sr{sub}2AlTaO{sub}6)0.35 solid solution, and NdGaO{sub}3) are presented. In order to obtain high quality substrates, different etchants (NH{sub}4F + HF, HCl + NH{sub}4Cl, and HCl + HNO{sub}3) with various pH values have been studied. From Atomic Force Microscopy (AFM), in air, we conclude that, irrespective of the etchant that has been used, a substrate surface with a BO{sub}x terminated layer and atomically flat terraces without etch pits could be obtained. The pH-value and temperature of the etchant and the etching time, however, influence significantly the surface quality. Reflection high energy electron diffraction (RHEED) patterns confirmed the AFM results.
机译:在具有原子平台梯田的氧化物电子基板中是一种不断增长的高质量外延薄膜的要求。在本文中,导致一些基质的化学蚀刻与钙钛矿,abo {sub} 3,结构(例如,srtio {sub} 3,lsat - (laalo {sub} 3)0.3(sr {sub} 2attao {sub} 6提出了0.35固溶体和Ndgao {sub} 3)。为了获得高质量的基材,已经研究了具有各种pH值的不同蚀刻剂(NH {亚} 4F + HF,HCl + NH {Sub} 4Cl和HCl + HNO {Sub} 3)。从原子力显微镜(AFM),在空气中,我们得出结论,无论已使用的蚀刻剂,都可以获得具有BO {SUB} X端接层的基板表面和没有蚀刻凹坑的原子平台。然而,蚀刻剂的pH值和温度和蚀刻时间显着影响表面质量。反射高能电子衍射(RHEED)模式证实了AFM结果。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号