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Wet etching apparatus for semiconductor device manufacturing and etching solution circulating method in wet etching apparatus
Wet etching apparatus for semiconductor device manufacturing and etching solution circulating method in wet etching apparatus
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机译:用于半导体器件制造的湿蚀刻设备以及湿蚀刻设备中的蚀刻溶液循环方法
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摘要
The present invention relates to a wet etching apparatus for manufacturing a semiconductor device and a method for circulating an etchant in a wet etching apparatus that smoothes the circulation of the etching liquid and prevents the byproducts from etching from contacting the wafer during etching.;A wet etching apparatus for manufacturing a semiconductor device according to the present invention includes an inner bath 11 in which a wafer to be etched is received, an outer bath 12 connected to the upper side of the inner bath 11, A circulation pipe 13 connected to the upper part of the inner tank 11 to circulate the etching solution through the circulation pipe 12 and a pump 14 mounted on the circulation pipe 13 for circulating the etching solution.;Therefore, according to the present invention, it is possible to prevent re-contamination of the wafer during the etching process by particles or the like which may be generated during the etching process.
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