FABRICATION PROCESS OF SEMICONDUCTOR DEVICE, WET-ETCHING TREATMENT APPARATUS, AND WET-ETCHING METHOD

摘要

PROBLEM TO BE SOLVED: To suppress generation of crystal deposits of etching liquid effectively.;SOLUTION: A wet-etching treatment apparatus comprises an etching chemical bath for storing wet-etching solution and performing wet-etching of a semiconductor wafer therein, a section for supplying nitrogen gas (N2) being supplied into the etching chemical bath during wet-etching operation, and a flow regulation section for feeding nitrogen gas (N2) supplied from the nitrogen gas supply section into the etching chemical bath during wet-etching operation and feeding nitrogen gas into the etching chemical bath continuously even when wet-etching is not performed.;COPYRIGHT: (C)2008,JPO&INPIT