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Fundamentals of III-V Semiconductor Electrochemistry and Wet Etching Processes: Br_2 Etching Properties onto InP

机译:III-V半导体电化学和湿法蚀刻工艺的基本原理:InP上的Br_2蚀刻性能

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摘要

Etching mechanism of InP in HBr/Br2 solution, is investigated correlating electrochemical characterization, XPS analyses, Indium dosage by GF-AAS, SEM analysis of cross sectional shapes of etching features. We observed the opposite electrochemical behavior toward reduction of Br_2 for n and p InP in the dark. The electrochemistry supports a description of the etching similar to the GaAs one, supposing a "chemical model" governs the process. Nevertheless XPS analyses of surface after etching shows that the etching implies oxidation processes that can only considered as resulting from the etching mechanism. So side oxidation process including hole injection contribution in the Br_2 reduction can be proposed opening a new element for discussion of the model that describe the etching properties of halogen oxidizing species as Br_2.
机译:研究了InP在HBr / Br2溶液中的蚀刻机理,与电化学表征,XPS分析,通过GF-AAS的铟剂量,蚀刻特征的截面形状的SEM分析相关。我们在黑暗中观察到相反的电化学行为,即n和p InP的Br_2还原。电化学支持类似于GaAs的蚀刻描述,假设“化学模型”控制了该过程。尽管如此,蚀刻后对表面的XPS分析表明,蚀刻意味着氧化过程,只能认为是由蚀刻机制导致的。因此,可以提出侧氧化工艺,包括空穴注入对Br_2还原的贡献,从而为讨论该模型(描述卤素氧化物种作为Br_2的刻蚀特性)的模型打开了一个新的元素。

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  • 会议地点 Montreal(CA);Montreal(CA);Montreal(CA)
  • 作者单位

    Institut Lavoisier de Versailles, UMR8180 CNRS-UVSQ, 45 Ave des Etats Unis 78035 Versailles France;

    Institut Lavoisier de Versailles, UMR8180 CNRS-UVSQ, 45 Ave des Etats Unis 78035 Versailles France;

    Institut Lavoisier de Versailles, UMR8180 CNRS-UVSQ, 45 Ave des Etats Unis 78035 Versailles France;

    Institut Lavoisier de Versailles, UMR8180 CNRS-UVSQ, 45 Ave des Etats Unis 78035 Versailles France;

    Institut Lavoisier de Versailles, UMR8180 CNRS-UVSQ, 45 Ave des Etats Unis 78035 Versailles France;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 材料;
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