Etching Apparatus for Flattening Both Surfaces of Semiconductor Wafer and Surface Flattening Method Using the Same

摘要

PURPOSE: An etching device for planarizing a surface of a semiconductor wafer and an etching apparatus using the same are provided to improve total thickness variation of a surface of a semiconductor wafer by using a bubble system. CONSTITUTION: An etching bath(42) for etching a wafer is installed in a housing(41). A rinse bath(41) for removing an etchant from a surface of the wafer is installed in the housing(41). A multitude of wafer is mounted in a barrel(15). Both shafts of the barrel(15) are connected with one end portion of a robot arm(40). A driving device(45) is moved by a cylinder(46). The other end portion of the robot arm(40) is rotated by the driving device(45). A circulation tank(44) is connected with the etching bath(42) through an etchant supply line(43). The barrel(15) is moved to an inside of the etching bath(42) by the robot arm(40). The wafer is rotated by a driving motor. A surface of the wafer is flattened by an etchant. The barrel(15) is moved to the rinse bath(41) by the robot arm(40). A flow rate control valve and a flow meter are installed at the etchant supply line(43).