Storage of semiconductor wafer after CMP includes exposure of the wafer to water before post-polishing cleaning, which prevents the drying out of the wafer

摘要

Wafer storage during time between completion of CMP and start of cleaning process comprises exposing the polished wafer to water which is treated to reduce oxidation effects on the wafer, caused by oxidizing agent contained in an abrasive used during CMP. Independent claims are also included for: (a) an apparatus (40) to store the polished wafer (20) which comprises a water tank (42), a pure water supply pipe (44), a recycling apparatus with return pipe (52), pump (49) and filter (50), and a discharge drain (48); and (b) a process storage of the wafer by keeping it immersed in pure water, to which an anticorrosion agent is added, preventing chemical attack of the metallic wiring of the wafer.