positive working, fotoempfindliche harzzusammensetzung and halbleiteranordnung with this composition

摘要

A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): CHEM wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a group represented by the formula: CHEM in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a + b = 100 mole %; a = 60.0 - 100.0 mole %; b = 0 - 40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C) 1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 mu m on a semiconductor element.