首页>
外国专利>
Integrated circuit package and flat plate molding process for integrated circuit package
Integrated circuit package and flat plate molding process for integrated circuit package
展开▼
机译:集成电路封装及集成电路封装的平板成型工艺
展开▼
页面导航
摘要
著录项
相似文献
摘要
An integrated circuit package having a top opening and a cavity, with a chip adhered in the cavity. The top opening has routing strips electrically connecting the top opening with the outer surface. The routing strips are electronically connected to bonding pads located in a central area of the chip. Following assembly of the components, the top opening and the cavity are encapsulated in a molding process. A method is provided for forming a substantially flat integrated circuit package.
展开▼