How the test probe and manufacturing semiconductor devices, a probe device using the probe needles, a test method of a semiconductor device according to the probe, and a semiconductor device which has been tested by the probe

摘要

PROBLEM TO BE SOLVED: To increase an area of true contact to a pad and obtain sure electric contact by setting an angle between a tangent of a leading end face of a probe at a surface of the pad and the surface of the pad when the pad is pressed to be a specific value or larger. ;SOLUTION: An electric connection between a probe 1 and a pad 2 is obtained when the pad 2 is sheared and deformed thereby breaking an oxidation film 8 at a surface and a fresh face is brought in touch with the probe at the probing time. An angle because of the shearing and deformation is determined by an orientation at the time of sputtering. Theoretically, supposing that the shearing is brought about only with an angle of a slide face, the pad is sheared at 0 or 35.3, that is, at angles so far from each other. However, experiments make it clear that a minimum angle of a slide face 6 enabling the shearing is 15 and an angle of the slide face bringing about the shearing stably is 17. Therefore, a leading end of the probe is shaped so that an angle of a vector 7 in a tangential direction of the leading end to the surface of the pad is not smaller than 15, preferably, not smaller than 17, whereby the oxidation film 8 of the pad surface can be broken and the probe can be brought in touch with the fresh face of the pad, thus achieving sufficient electric connection.;COPYRIGHT: (C)1999,JPO