PROBE NEEDLE FOR TESTING SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND PROBE CARD WITH THE PROBE NEEDLE

摘要

PROBLEM TO BE SOLVED: To provide a high-productivity probe needle which can obtain a sure electrical contact with a small slip amount of the needle and can prevent an electrode pad from being damaged by increasing a true contact area between a leading end of the probe needle and the electrode pad, a manufacturing method for the probe needle, and a probe card.;SOLUTION: The probe needle for testing the operation of a semiconductor device by pressing the leading end part to the electrode pad of the semiconductor device and electrically contacting the leading end part with the electrode pad is constituted of a side face part and the leading end part. The leading end part is made a spherical surface. A first surface of the surface is positioned nearly in a direction in which the probe needle further slides and moves relatively to the electrode pad after butting against the electrode pad. A curvature of the first surface is made larger than a curvature of a second surface at the opposite side to the first surface, and moreover a radius of curvature of the first surface is made 7-30 μm.;COPYRIGHT: (C)2002,JPO