POLISHING APPARATUS, POLISHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE BY USING THIS POLISHING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURED BY THIS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of realizing a high throughput by saving time.;SOLUTION: In an index table 340 in the center of the polishing apparatus, there are provided a plurality of chucks V1-V4, and a plurality of polishing stages 310, 320, 330 are provided corresponding to positioning stop positions thereof. A plurality of freely swinging polishing arms 311, 312 and a pad dresser 317 for dressing a polishing pad on the ends of the arms are provided on the stages. The polishing pad of the B arm 312 is dressed while the A arm 311 performs a polishing process. In the next step, the polishing pad of the A arm 311 is dressed while the B arm 312 performs a polishing process.;COPYRIGHT: (C)2002,JPO