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Formation manner null of constituent and electric conduction film for electric conduction film formation

机译:用于导电膜形成的成分和导电膜的形成方式无效

摘要

PURPOSE: To obtain a composition for forming conductive film which, when applied and baked, can be formed into a conductive film excellent in haze, conductivity and adhesion, by adding a tin-containing indium oxide powder to a solvent, an organic compound, and an organic acid metal salt compound. ;CONSTITUTION: This composition for forming a conducive film comprises a thin-containing indium oxide (ITO powder), a solvent, an organic compound (e.g. a 1-18C aliphatic carboxylic acid, a 6-20C aromatic carboxylic acid, and a phosphonic acid having an ethylene oxide chain), and an organic acid metal salt compound (e.g. salt (Co, Ni, Pb, In, Al, Fe, Ti, Sb, and Zn) of an organic acid compound), with the amount of the powder being 100 pts.wt., the amount of the organic compound being 1 to 40 pts.wt., and the amount of the organic acid metal compound being 0.2 to 15 pts.wt. In comparison with a conventional composition for forming a conductive film that uses a binder (conductive coating material), the above coating material can form a transparent conductive film excellent in transparency, conductivity, and adhesion.;COPYRIGHT: (C)1996,JPO
机译:用途:获得一种用于形成导电膜的组合物,该组合物在施涂和烘烤后,可通过向溶剂,有机化合物和溶剂中添加含锡的氧化铟粉,制成雾度,导电性和粘附性优异的导电膜。有机酸金属盐化合物。 ;组成:该用于形成导电膜的组合物包含稀薄的氧化铟(ITO粉),溶剂,有机化合物(例如1-18C脂族羧酸,6-20C芳族羧酸和膦酸)具有一定量粉末的有机化合物,具有环氧乙烷链)和有机酸金属盐化合物(例如有机酸化合物的盐(Co,Ni,Pb,In,Al,Fe,Ti,Sb和Zn的盐))为100pts.wt。,有机化合物的量为1至40pts.wt。,有机酸金属化合物的量为0.2至15pts.wt。与使用粘合剂(导电涂料)的用于形成导电膜的常规组合物相比,上述涂料可以形成透明性,导电性和粘附性优异的透明导电膜。; COPYRIGHT:(C)1996,JPO

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