CONNECTING METHOD FOR BOARD; MANUFACTURING METHODS USING THE CONNECTING METHOD AND FOR MANUFACTURING WIRING BOARD, BOARD FOR SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE; AND WIRING BOARD, BOARD FOR SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a connecting method for boards whereby a small connection resistance and a high connection reliability are obtained.;SOLUTION: A connecting method for boards wherein two boards having their connection terminals are pressed on each other while opposing their connection terminals to each other and applying to one of them an ultrasonic vibration in its surface direction; manufacturing methods using the connecting method and for manufacturing a wiring board, a board for semiconductor packages, and a semiconductor package; and the wiring board, the board for semiconductor packages, and the semiconductor package which are manufactured by the manufacturing methods.;COPYRIGHT: (C)2002,JPO