Manufacturing processing methods and the connection board production process and the connection board and the multilayer wiring board manufacturing method and a multilayer wiring board and a semiconductor manufacturing method of the package substrate and the substrate and the semiconductor package for a semiconductor package that uses the processing method of the thin plate-like article Methods and semiconductor package

摘要

PROBLEM TO BE SOLVED: To provide a processing method capable of uniformly performing grinding and efficiently processing a thin plate-like article, a connection substrate manufactured by the processing method and excellent in accuracy, strength and connection reliability, and capable of connecting only a necessary place, a multilayered wiring board using the connection substrate, a substrate for a semiconductor package and the semiconductor package, and to provide a method for efficiently manufacturing them.;SOLUTION: In the method for processing the thin plate-like article, a resin layer having tackiness is formed on the surface of either one of a support substrate high in rigidity or the thin plate-like article, and the support substrate high in rigidity and the thin plate-like article are laminated through the resin layer to perform processing. The connection substrate using the processing method, the multilayered wiring board, a method for manufacturing the multilayered wiring board, the substrate for the semiconductor package and a method for manufacturing the semiconductor package are also disclosed.;COPYRIGHT: (C)2002,JPO