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Semiconductor wafer including a dot mark of a peculiar shape and method of forming the dot mark

机译:包括特殊形状的点标记的半导体晶片及其形成方法

摘要

A fine protruded dot-like mark is formed on part of a semiconductor wafer surface. A growth layer is grown by epitaxial treatment on an entire surface of a semiconductor wafer including the dot mark so as to form a dot mark. During this growth process, the dot-like mark is changed into a polygon pyramid shape including a clear ridge line indicating the same azimuth of the crystal axis as that of the wafer. This ridge line is optically read out so that the azimuth of the crystal axis of the wafer can be specified. Therefore, it is possible to obtain a semiconductor wafer including a dot mark having a peculiar shape excellent in optical visibility and indicating the azimuth of the crystal axis and to provide a method of forming the dot mark.
机译:在半导体晶片表面的一部分上形成有细微突出的点状标记。通过外延处理在包括点标记的半导体晶片的整个表面上生长生长层,以形成点标记。在该生长过程中,点状标记变成包括清楚的脊线的多边形金字塔形状,该脊线表示与晶片的晶轴相同的方位角。该棱线被光学地读出,从而可以确定晶片的晶轴的方位角。因此,可以获得包括具有光学可见性优异并且指示晶轴的方位角的奇特形状的点标记的半导体晶片,并提供形成点标记的方法。

著录项

  • 公开/公告号US06436842B1

    专利类型

  • 公开/公告日2002-08-20

    原文格式PDF

  • 申请/专利权人

    申请/专利号US09776269

  • 发明设计人 AKIRA MORI;TEIICHIROU CHIBA;

    申请日2001-02-02

  • 分类号H01L213/10;H01L214/69;

  • 国家 US

  • 入库时间 2022-08-22 00:53:07

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