Wafer-scale package structure and circuit board used therein

摘要

A wafer-scale package structure in which a circuit board (6) for rearranging electrode pads (8) of a wafer (7) is laminated on the water integrally. The circuit board can be divided into individual chip-size packages (CSPs) and which includes a layer of polyimide resin (3), and connection between the wafer and the circuit board is performed by solder bump (5), while the circuit board is stuck on the wafer with an adhesive (4).