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SEMICONDUCTOR DEVICE COMBINING THE ADVANTAGES OF MASSIVE AND SOI ARCHITECTURE, AND METHOD FOR MAKING SAME

机译:结合了大规模和SOI体系结构优势的半导体器件及其制造方法

摘要

A semiconductor device, having source/drain regions (23, 24) covering opposite silicon thin film end zones (13a) extending beyond an overlying gate dielectric layer (14), is new. A semiconductor device has a channel region defined between source and drain regions (23, 24) in a silicon body (10), a gate (15) on a gate dielectric thin film (14) above the channel region, a buried dielectric layer (22) and a silicon thin film (13) extending between the source and drain regions and contained between the buried dielectric layer (22) and the gate dielectric layer (14). The novelty is that the silicon thin film (13) has an area greater than that of the gate dielectric layer (14) so that its upper surface has two opposite zones (13a) which extend beyond the gate dielectric layer (14), the source and drain regions (23, 24) covering respective opposite zones (13a). An Independent claim is also included for production of the above device.
机译:新型的半导体器件具有覆盖覆盖相对的硅薄膜端部区域(13a)的源极/漏极区域(23、24),该相对的硅薄膜端部区域(13a)延伸超过上层的栅极介电层(14)。半导体器件具有:在硅主体(10)中的源极区和漏极区(23、24)之间限定的沟道区,在沟道区上方的栅极电介质薄膜(14)上的栅极(15),埋入的介电层( 22)和在源极和漏极区域之间延伸并包含在掩埋电介质层(22)和栅极电介质层(14)之间的硅薄膜(13)。新颖之处在于,硅薄膜(13)的面积大于栅极电介质层(14)的面积,因此其上表面具有两个相对的区域(13a),它们延伸超出栅极电介质层(14),即源极漏极区(23、24)分别覆盖相对的区域(13a)。对于上述设备的生产也包括独立权利要求。

著录项

  • 公开/公告号EP1218942A1

    专利类型

  • 公开/公告日2002-07-03

    原文格式PDF

  • 申请/专利权人 FRANCE TELECOM;

    申请/专利号EP20000966241

  • 申请日2000-09-29

  • 分类号H01L29/417;H01L29/786;H01L21/336;

  • 国家 EP

  • 入库时间 2022-08-22 00:33:04

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