首页> 外国专利> Applying structured layer to support substrate involves filling structured pattern substrate with filler, placing pattern on support, binding filler to support, and removing pattern so that filler remains bonded to support

Applying structured layer to support substrate involves filling structured pattern substrate with filler, placing pattern on support, binding filler to support, and removing pattern so that filler remains bonded to support

机译:将结构化层施加到支撑衬底上包括用填料填充结构化图案衬底,将图案放置在支撑体上,将填充剂粘合到支撑体上,并去除图案以使填充剂保持粘结到支撑体上

摘要

Applying a structured layer to a support substrate (101) involves filling a structured pattern substrate (102) corresponding to the structured layer with a filler; placing the pattern substrate on the support substrate; bonding so that the filler binds to the substrate; and removing the pattern substrate so that the filler remains bound to the support structure and the structured layer is formed on the support substrate. Preferred Features: The pattern substrate is printed on the support substrate. The pattern substrate is made from a material having a higher melting point than the filler and the material of the support substrate. The pattern substrate is made form silicon dioxide. A pattern substrate release layer is applied to the structured surface of the pattern layer.
机译:将结构化层施加到支撑基板(101)包括用填料填充对应于该结构化层的结构化图案基板(102)。将图案基板放置在支撑基板上;结合,使填料结合到基材上;去除图案基板,以使填料保持与支撑结构的结合,并在支撑基板上形成结构化层。优选特征:图案基板被印刷在支撑基板上。图案基板由熔点比填料和支撑基板的材料高的材料制成。图案基板由二氧化硅制成。将图案衬底释放层施加到图案层的结构化表面上。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号