首页> 外国专利> Printed circuit board as a circuit carrier with two metal outer layers and a metal intermediate layer has insulating layers between the outer and intermediate layers with a cooling component on an outer layer linked via a heat path.

Printed circuit board as a circuit carrier with two metal outer layers and a metal intermediate layer has insulating layers between the outer and intermediate layers with a cooling component on an outer layer linked via a heat path.

机译:作为具有两个金属外层和一个金属中间层的电路载体的印刷电路板,在外层和中间层之间具有绝缘层,在外层上具有通过热路径连接的冷却组件。

摘要

A heat conductor path runs partly in an intermediate layer (11,12) conveying heat crosswise. A component (3) and a cooling element (6) are connected to the intermediate layer by electro-plating. The electro-plated contact forms a metal thermal through-contact (16).
机译:导热路径部分在中间层(11,12)中横向传播。部件(3)和冷却元件(6)通过电镀连接到中间层。电镀的触点形成金属热穿透触点(16)。

著录项

  • 公开/公告号DE10127268A1

    专利类型

  • 公开/公告日2002-04-25

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE2001127268

  • 申请日2001-06-05

  • 分类号H05K7/20;H05K1/02;H05K3/46;

  • 国家 DE

  • 入库时间 2022-08-22 00:26:56

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