Metallic cooling element i.e. metal plate, for use in circuit housing of printed circuit board, has outer side whose portion is covered with thin layer formed from plastic material, where outer side of layer provides radiation surface

摘要

The cooling element has an outer side whose one portion is covered with a thin layer (40), where an outer side of the thin layer provides a radiation surface. The thin layer is formed from plastic material. The thin layer exhibits dielectric strength defined by thickness and electrical material properties of the thin layer. Cooling surface-molding material provide a shoulder in the form of thicker edge areas (40a, 40b), where the edge areas and the thin layer form a flat surface. Independent claims are also included for the following: (1) a printed circuit board comprising a circuit housing consisting of housing-molding material and cooling surface molding material formed from injectable or cast-capable plastic (2) a method for producing a cooling element (3) a method for producing a circuit housing.