PROBLEM TO BE SOLVED: To prevent the useless consumption of wafers for measuring film thickness by arranging a substrate-like film thickness measuring jig on a semiconductor wafer mounting position and, at the same time, forming the measuring jig in the same shape as that of a wafer and a chip mounting section on the chip mounting section of which a film thickness measuring chip is disposed. ;SOLUTION: Four holding bars 13d are uprightly arranged between a top plate 13b and a bottom plate 13c and a film thickness measuring jig 11 is detachably attached to appropriate positions of the holding grooves 13a of the bars 13d. Then chips 12 for measuring film thickness 12 are housed in the upper surface of the jig 11 and square grooves which are chip mounting sections having nearly the same shape as that of the chips 12 are formed so as to retain the chips 12 in forming a film on the surface of a wafer. Therefore, since the chips 12 are arranged only at the location where the thickness of a deposited film is measured, the amount of silicon wafers used for film thickness measurement can be minimized.;COPYRIGHT: (C)1998,JPO
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