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CHARGED BEAM EXPOSURE APPARATUS, OPTICAL EXPOSURE METHOD USING CHARGED BEAM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE OPTICAL EXPOSURE METHOD
CHARGED BEAM EXPOSURE APPARATUS, OPTICAL EXPOSURE METHOD USING CHARGED BEAM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE OPTICAL EXPOSURE METHOD
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机译:带电束曝光设备,使用带电束的光学曝光方法以及使用该光学曝光方法制造半导体器件的方法
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摘要
PROBLEM TO BE SOLVED: To provide a charged beam exposure apparatus and an optical exposure method which markedly reduces the influence of a space charge effect and therefore has small aberration.;SOLUTION: The charged beam exposure apparatus 1 comprises an electron gun 11 for producing a charged beam 8 with low acceleration to be free of the influence of a proximity effect, illumination lens system 15, a cell aperture 19, deflection systems 17 and 21 which deflect the charged beam 8 by an electric field and then make it incident into a desired cell pattern of the cell aperture 19, and thereafter, bend the charged beam 8 which has passed through them back on the optical axis, a reduction projection optical system 23 (Q1-Q4) which reduces the charged beam 8 which has passed through the deflection system 21 by an electric field to make it form an image on a wafer 14, and deflection systems 25 and 31 which deflect the charged beam 8 by an electric field and scan the beam over the wafer 14. The charged beam exposure apparatus 1 also comprises illumination position adjusting means 40-48 which adjust the illumination position of the charged beam 8 so that the charged beam 8 incident into the reduction projection optical system moves on a trajectory symmetric with respect to an optical axis in one of two planes which cross each other at right angles on the optical axis.;COPYRIGHT: (C)2004,JPO
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