PROBLEM TO BE SOLVED: To provide a carrier tape for electronic components in which the position of a rail of a mounting machine need not be adjusted according to the thickness of an embossed tape, and the carrier tape wound around a reel does not meander when feeding the tape, and to provide a method for mounting the electronic components on a mount substrate. SOLUTION: In the carrier tape for accommodating and transporting or carrying the electronic components, projections 12 are provided on predetermined areas of the embossed tape 1 constituting the carrier tape. Since the height of the projections is added to the thickness of the embossed tape, the height (position) of the rail of the mounting machine need not be adjusted. Since the projections reinforce the embossed tape, the meandering of the carrier tape wound around the reel can be prevented. In addition, a manufacturing step can be simplified because the carrier tape can be worked simultaneously when forming pockets in the embossing step for forming the pockets.
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