Basic study on cooling performance of pulsating airflow around components mounted in high-density packaging electronic equipment (effects of shapes of components on cooling performance)

摘要

This study describes a cooling performance of pulsating airflow around an obstruction mounted in a rectangular duct which simulates high-density packaging electronic equipment. Several researchers have reported the possibility of the heat transfer enhancement by pulsating flow. Our study is trying to apply pulsating flow to the heat transfer enhancement method in electronic equipment. In this report, the cooling performance of the pulsating airflow around the cylinder type obstruction and the square prism type obstruction individually. The obstructions simulate components in electronic equipment. It was found that the cooling performance of the obstructions by using pulsating airflow can be observed regardless of the shape of the obstruction.