FILM CARRIER TAPE FOR MOUNTING ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, FILM CARRIER TAPE PACKAGE BODY FOR MOUNTING THE ELECTRONIC COMPONENT AND PRESERVING/TRANSFER METHOD

摘要

PROBLEM TO BE SOLVED: To reduce shift in the total pitch width of an inner lead in storage/ transfer. ;SOLUTION: In a film carrier tape for mounting electronic components, a prescribed wiring pattern formed of conductive metal foil is formed on the surface of an insulating film. A solder resist is applied to the wiring pattern by leaving a lead part and the lead part is plated. The film carrier tape for mounting electronic components has humidification history, where humidity is kept to the condition of 60%±5% after the lead part is plated. The tape is further closed and stored in a water impermeable package body.;COPYRIGHT: (C)2001,JPO