BATCH-PROCESS WIRING BOARD, WIRING BOARD, PACKAGE FOR STORING BATCH-PROCESS SEMICONDUCTOR ELEMENT, AND PACKAGE FOR STORING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a reliable product having a superior high-frequency signal transmission characteristic by eliminating the problem that a fragment of a conductor pattern remains in a state connected to a signal line and therefore a high-frequency signal goes to a conductor pattern by a roundabout way.;SOLUTION: A batch-process wiring board comprises a plurality of wiring patterns formed across a dividing groove 6 between adjacent wiring board areas; and linear conductor patterns 5, each of which is formed across the dividing groove 6 between adjacent wiring patterns and is connected to each wiring pattern 2 only in one of the two wiring board areas.;COPYRIGHT: (C)2003,JPO