WIRING BOARD FOR ACQUIRING MANY DIVIDED WIRING-BOARDS, THE WIRING-BOARD, PACKAGE FOR STORING SEMICONDUCTOR ELEMENT USING THE WIRING BOARD, AND PACKAGE FOR STORING SEMICONDUCTOR-ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable product of superior high-frequency signal transmitting characteristic, by preventing high-frequency signals from passing through the cut-out pieces of its continuity patterns which remain in the state with their being connected with its signal lines.;SOLUTION: In a wiring board for acquiring many divided wiring-boards, there are provided a plurality of wiring patterns 2, each of which being formed between adjacent divided wiring-board-regions to each other so as to intersect crosswise a dividing line; and a plurality of continuity patterns 5 each of which is formed between adjacent wiring patterns 2 to each other so as to bridge a dividing line, and to be connected with one of the wiring patterns 2, in only one of the adjacent divided wiring-board regions to each other.;COPYRIGHT: (C)2002,JPO