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Selective deposition of undoped silicon film seeded in chlorine and hydride gas for a stacked capacitor

机译:选择性沉积淀积在氯和氢化物气体中的未掺杂硅膜,用于堆叠电容器

摘要

A polysilicon film is formed with enhanced selectivity by flowing chlorine during the formation of the film. The chlorine acts as an etchant to insulative areas adjacent polysilicon structures on which the film is desired to be formed. Bottom electrodes for capacitors are formed using this process, followed by an anneal to create hemishperical grain (HSG) polysilicon. Multilayer capacitor containers are formed in a non-oxidizing ambient so that no oxide is formed between the layers. The structure formed is planarized to form separate containers made from doped and undoped amorphous silicon layers. Selected ones of undoped layers are seeded in a chlorine containing environment and annealed to form HSG. A dielectric layer and second electrode are formed to complete the cell capacitor.
机译:通过在膜形成期间使氯流过而形成具有提高的选择性的多晶硅膜。氯用作与希望在其上形成膜的多晶硅结构相邻的绝缘区域的蚀刻剂。使用此工艺形成电容器的底部电极,然后进行退火以生成半球状晶粒(HSG)多晶硅。在非氧化环境中形成多层电容器容器,从而在各层之间不形成氧化物。将形成的结构平面化以形成由掺杂和未掺杂的非晶硅层制成的单独的容器。将选定的未掺杂层播种到含氯环境中,然后退火以形成HSG。形成介电层和第二电极以完成单元电容器。

著录项

  • 公开/公告号US2003153142A1

    专利类型

  • 公开/公告日2003-08-14

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US20030368069

  • 发明设计人 JAMES PAN;RANDHIR P.S. THAKUR;

    申请日2003-02-18

  • 分类号H01L21/8238;

  • 国家 US

  • 入库时间 2022-08-22 00:11:08

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