首页>
外国专利>
Solder bonding technique for assembling a tilted detector chip
Solder bonding technique for assembling a tilted detector chip
展开▼
机译:用于组装倾斜检测器芯片的焊接技术
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of asymmetric solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. This causes the chip to tilt to one side about the axis defined by the asymmetric pads.
展开▼