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Method of forming a semiconductor device with a multi-layer WSix film with small grain size structure, and a semiconductor device having a polysilicon layer with a multi-layer WSix film formed thereon
Method of forming a semiconductor device with a multi-layer WSix film with small grain size structure, and a semiconductor device having a polysilicon layer with a multi-layer WSix film formed thereon
A method of forming a semiconductor device with a polysilicon layer having a multi-layer tungsten-silicide (WSix) film formed on a surface thereof includes the steps of (1) forming a first layer of tungsten-silicide on the surface of the polysilicon layer; (2) forming a second layer of a material selected from tungsten and silicon on the first layer; (3) forming a third layer of tungsten-silicide on the second layer; and (4) thermally treating the multi-layer film resulting from steps (a)-(c) to form a multi-layer WSix film on the surface of the polysilicon layer, the multi-layer WSix film having a uniform small grain size. In various embodiments, steps (1)-(3) may be repeated one or more times. A semiconductor device includes a semiconductor body having a polysilicon layer formed on a surface thereof and a multilayered WSix film formed on a surface of the polysilicon layer by the process described above.
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机译:一种形成具有多晶硅层的半导体器件的方法,该多晶硅层具有在其表面上形成的多层硅化钨(WSi x Sub>)膜,包括以下步骤:(1)形成第一层钨-多晶硅层表面上的硅化物; (2)在第一层上形成第二层选自钨和硅的材料。 (3)在第二层上形成第三层硅化钨; (4)对步骤(a)-(c)得到的多层膜进行热处理,以在多晶硅层的表面上形成多层WSi x Sub>膜。具有均匀小晶粒尺寸的 x Sub>膜。在各种实施例中,步骤(1)-(3)可以重复一次或多次。半导体器件包括通过上述方法在其表面上形成有多晶硅层和在多晶硅层的表面上形成的多层WSi x Sub>膜的半导体本体。
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