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METHODS OF ELECTROLESS DEPOSITION OF NICKEL, AND METHODS OF FORMING UNDER BUMP METALLURGY, AND CONSTRUCTIONS COMPRISING SOLDER BUMPS
METHODS OF ELECTROLESS DEPOSITION OF NICKEL, AND METHODS OF FORMING UNDER BUMP METALLURGY, AND CONSTRUCTIONS COMPRISING SOLDER BUMPS
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机译:镍的化学沉积方法,碰撞冶金下的形成方法以及包括焊料凸点的结构
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摘要
The invention includes a method of electroless deposition of nickel over an aluminum-containing material. A mass is formed over the aluminum-containing material, with the mass predominantly comprising a metal other than aluminum. The mass is exposed to palladium, and subsequently nickel is electroless deposited over the mass. The invention also includes a method of electroless deposition of nickel over aluminum-containing materials and copper-containing materials. The aluminum-containing materials and copper-containing materials are both exposed to palladium-containing solutions prior to electroless deposition of nickel over the aluminum-containing materials and copper-containing materials. Additionally, the invention includes a method of forming a solder bump over an aluminum-containing material.
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