首页> 外国专利> ELECTROLESS NICKEL PLATING BATH FOR FORMING ANISOTROPICALLY GROWN BUMP, METHOD FOR FORMING ANISOTROPICALLY GROWN BUMP, ARTICLE HAVING ANISOTROPICALLY GROWN BUMP FORMED THEREON AND ANISOTROPIC GROWTH ACCELERATOR FOR ELECTROLESS NICKEL PLATING BATH

ELECTROLESS NICKEL PLATING BATH FOR FORMING ANISOTROPICALLY GROWN BUMP, METHOD FOR FORMING ANISOTROPICALLY GROWN BUMP, ARTICLE HAVING ANISOTROPICALLY GROWN BUMP FORMED THEREON AND ANISOTROPIC GROWTH ACCELERATOR FOR ELECTROLESS NICKEL PLATING BATH

机译:用于形成各向异性生长凸起的化学镀镍浴,用于形成各向异性生长凸起的方法,具有异型生长凸起的制品以及用于化学镀镍浴的各向异性生长促进剂

摘要

An electroless nickel plating bath for forming an anisotropically grown bump, characterized in that it comprises an anisotropic growth accelerator in an amount necessary to exhibit the effect to accelerate anisotropic growth; a method for forming an article having an anisotropically grown nickel bump; an article having an anisotropically grown nickel bump formed thereon; and an anisotropic growth accelerator for an electroless nickel plating bath. The electroless nickel plating bath allows the formation of bumps which have the form of a dome, have a high aspect ratio and are reduced in the variation in their heights, which bumps are required for corresponding with the tendency of broader range, more pins and a narrower pitch.
机译:一种用于形成各向异性生长的凸块的化学镀镍浴,其特征在于,其包含各向异性生长促进剂,其量必须具有加速各向异性生长的效果。一种形成具有各向异性生长的镍凸块的制品的方法;在其上形成有各向异性生长的镍凸块的制品;以及用于化学镀镍浴的各向异性生长促进剂。化学镀镍浴允许形成具有圆顶形状,高纵横比并减小其高度变化的凸块,而凸块是与范围更广,引脚更多和引脚越小的趋势相对应所必需的。音高变窄。

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