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Development of Pb-Sn Base Alloy Wires for Fine and Precise Pitch Soldering and New Bump Formation Method.

机译：Pb-Sn基合金电线的开发精细且精确的俯仰焊接和新的凸块形成方法。

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Toshinori Ogashiwa; Hideyuki Akimoto; Hiroyuki Shigyo; Akihisa Inoue; Tsuyoshi Masumoto;
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年度 1994
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2. Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability [J] . Seung-Min Chung, Young-Ho Kim Materials transactions . 2007,第1期

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3. Fine-pitch bonding technology with surface-planarized solder micro-bump/ polymer hybrid for 3D integration [J] . Inoue Fumihiro, Derakhshandeh Jaber, Lofrano Melina, Japanese journal of applied physics . 2021,第2期

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4. Wafer IMS (Injection molded solder) #x2014; A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility [C] . Nah Jae-Woong, Gelorme Jeffrey, Sorce Peter, IEEE Electronic Components and Technology Conference . 2014

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5. Wetting behaviors and interfacial reactions of lead-containing and lead-free solder alloys on gold, palladium, nickel foils, leadframes, and under-bump thin film metallizations in electronic packaging. [D] . Kim, Patrick Gu-Ho. 1998

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6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

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7. Characteristics of Rapid Solidified Pb-Sn Alloy Wires and Their Application to Solder Bump for Fine Junction [O] . Toshinori Ogashiwa, Akihisa Inoue 1994

机译：快速凝固PB-SN合金电线的特性及其在精细交界处焊接凸起的应用

Development of Pb-Sn Base Alloy Wires for Fine and Precise Pitch Soldering and New Bump Formation Method.

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