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Anisotropic conductive film and method of fabricating the same for ultra-fine pitch COG application
Anisotropic conductive film and method of fabricating the same for ultra-fine pitch COG application
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机译:用于超细间距COG应用的各向异性导电膜及其制造方法
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摘要
Disclosed are an anisotropic conductive film and a method of fabricating the same suitable for realizing an ultra-fine pitch COG (Chip On Glass) application. The anisotropic conductive film of the present invention is characterized in that 1-30% by volume nonconductive particles (polymer, ceramic, etc.) having a diameter {fraction (1/20)}- times as large as the conductive particles are added. According to the present invention, the anisotropic conductive film can prevent an electrical shorting between the bumps in bonding ultra fine pitch flip chip as well as in COG-bonding the driver IC. Accordingly, the anisotropic conductive film can be widely used in a communication field using ACA flip chip technology and universal flip chip packages.
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