首页> 外国专利> Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making

Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making

机译:用于导电部件的吸附装置,吸盘和安装装置,用于导电部件的吸附方法和安装方法以及半导体装置及其制造方法

摘要

A conductive-member adsorbing device has an adsorber having adsorption portions for adsorbing conductive members and a force supply unit. The force supply unit is operative to apply a force which can maintain one conductive member adsorbed by one adsorption portion, but can release two conductive members adsorbed by one adsorption portion.
机译:导电构件吸附装置具有:吸附器,其具有用于吸附导电构件的吸附部;以及力供给单元。力提供单元可操作地施加力,该力可以维持一个导电部件被一个吸附部吸附,但是可以释放两个导电部件被一个吸附部吸附。

著录项

  • 公开/公告号US6638785B2

    专利类型

  • 公开/公告日2003-10-28

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORPORATION;

    申请/专利号US20020314141

  • 发明设计人 MASAKUNI SHIOZAWA;TOMOYUKI SHINDO;

    申请日2002-12-09

  • 分类号H01L210/00;

  • 国家 US

  • 入库时间 2022-08-22 00:05:32

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