首页> 外国专利> Application of acoustic film volume resonators in micro shafts housings using a flip chip technique - -

Application of acoustic film volume resonators in micro shafts housings using a flip chip technique - -

机译:倒装芯片技术将声膜体积谐振器应用于微轴壳体--

摘要

A device comprises a chip, which contains a filter circuit. The filter is with the use of acoustic film implemented volume resonators. A housing contains the chip. The housing comprises a base portion, signal paths are contained in the base portion. Soldered connections fastening the chip to the base portion. The soldering connection pads on the chip is electrically connected to the signal paths in the base portion. The soldered connections no wire connections comprise and are used instead of the same.
机译:一种设备包括芯片,该芯片包含滤波电路。该滤波器与使用声学膜实现的体积谐振器一起使用。外壳包含芯片。壳体包括基部,信号路径包含在基部中。焊接连接将芯片固定到基座部分。芯片上的焊接连接焊盘电连接到基部中的信号路径。焊接连接不包含任何导线连接,可以代替它们使用。

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