Application of acoustic film volume resonators in micro shafts housings using a flip chip technique - -

摘要

A device with the following features:a chip (12), a filter circuit (64, 70), wherein the filter circuit (64, 70) with the use of acoustic film volume resonators (50 – 53, 64, 70) is implemented;a housing (10), comprising the chip (12), wherein the housing (10) comprises a base layer (18), and wherein signal paths (19, 20) by means of the base layer (18); andSoldered connections (13, 14), by means of which the chip (12) on the base layer (18) is fastened, and the soldered connections (13, 14) pads on the chip (12) is electrically connected to the signal paths (19, 20) in the base layer (18), and wherein the soldered connections (13, 14) comprise no bonding wires are used, and, instead of the same.